System-on-Package (SOP) Architectures for compact and low cost RF Front-end modules

Author

Pinel, S. ; Lim, K. ; DeJean, R.G. ; Li, L. ; Lee, C.-H. ; Maeng, M. ; Davis, M.F. ; Tentzeris, M. ; Laskar, J.

Author_Institution

Packaging Research center, Yamacraw Design Center, School of Electrical and Computer Engineering, Georgia Institute of Technology, Atlanta GA 30332-0269 USA. Fax:(404) 894-5028, Email: pinel@ece.gatech.edu

fYear

2003

fDate

Oct. 2003

Firstpage

307

Lastpage

310

Abstract

This paper presents the development of advanced System-on-Package (SOP) architectures for compact and low cost wireless RF wireless systems. We present the design of compact stacked patch antennas using SHS structures for LMDS and Vband applications. Multi-layer organic packaging development for SOP is reported. An Intelligent Network Communicator (INC) RF block is presented as example of the high performances of multi-layer organic package. A novel ultra-compact 3D integration technology for SOP-based solutions is proposed and utilized for the implementation of a Ku band VCO module. In addition, the fabrication of very high Qfactor inductors in Liquid Crystal Polymer multi-layer substrate demonstrate superior performances compared to any other multilayer organic packages.

Keywords

Costs; Fabrication; Inductors; Intelligent networks; Liquid crystal polymers; Nonhomogeneous media; Packaging; Patch antennas; Radio frequency; Voltage-controlled oscillators;

fLanguage

English

Publisher

ieee

Conference_Titel

Microwave Conference, 2003 33rd European

Conference_Location

Munich, Germany

Print_ISBN

1-58053-834-7

Type

conf

DOI

10.1109/EUMA.2003.340951

Filename

4143015