DocumentCode
2213957
Title
Wafer Level Reliability Testing Physics and Modelling
Author
Tyree, Vance C. ; Pierce, Donald G.
Author_Institution
USC/Information Sciences
fYear
1993
fDate
24-27 Oct 1993
Firstpage
187
Lastpage
187
Keywords
Circuit testing; Electromigration; Equations; Extrapolation; Failure analysis; Life estimation; Materials testing; Physics; Semiconductor device modeling; Stress;
fLanguage
English
Publisher
ieee
Conference_Titel
Integrated Reliability Workshop Final Report, 1993 International
Type
conf
DOI
10.1109/IRWS.1993.666307
Filename
666307
Link To Document