Nonlinear loaded microstrip interconnet analysis with temperature effect

This paper addresses a signal integrity analysis of printed circuit board electrical interconnect with nonlinear capacitance and resistance loads. Based on the global model based on the RLC equivalent circuit of the microstrip line, the routine algorithm of interconnect network is proposed. After numerical computation, it can be found that the nonlinear load can degrade significantly the interconnect responses notably with the occurrence of resonance effects. Based on the measurement of microstrip interconnect printed on FR4-epoxy at the temperature {40°C, 100°C, 140°C}, frequency responses from DC to 3GHz were analyzed. The microstrip interconnect responses were analyzed with transient testing and 0.1Gbps rate bit stream eye diagram. The proposed analysis method can be potentially used for assessing the performance of high density printed circuit board.