DocumentCode :
2214118
Title :
Nanostructured bulk thermoelectric materials and their properties
Author :
Lee, Eugene ; Ryu, Jae ; Bhattacharya, Sriparna ; Tritt, Terry
Author_Institution :
Aspen Syst., Inc., Marlborough, MA, USA
fYear :
2005
fDate :
19-23 June 2005
Firstpage :
284
Lastpage :
287
Abstract :
Advanced bulk thermoelectric materials have been developed by fabricating composites of uniformly distributed thermoelectric nanoparticles within a high surface area semiconductor matrix. In this composite structure, constituents of the thermoelectric materials´ figure of merit can be decoupled and controlled independently, and consequently, one can achieve a high thermoelectric figure of merit. The produced composites exhibited extremely low thermal conductivity and relatively high electrical conductivity. However, the Seebeck coefficient was relatively low, probably due to poor quality of the thermoelectric particles. In an in-plane test geometry (van der Pauw configuration), the electrical resistivity of the composite sample decreased continuously as temperature increased, a typical semiconductor behavior. In the perpendicular-to-the-plane (cross-plane) test geometry, electrical resistance of the sample increased continuously with increasing temperature, probably a semi-metallic behavior. This anisotropy in the electrical resistance was reproducible. We also observed relatively strong high frequency AC-signals in the in-plane test geometry samples.
Keywords :
Seebeck effect; electrical resistivity; elemental semiconductors; nanocomposites; nanoparticles; nanotechnology; silicon; thermal conductivity; Seebeck coefficient; Si; electrical conductivity; electrical resistivity; nanocomposites; nanostructured bulk thermoelectric materials; perpendicular-to-the-plane test geometry; semi-metallic behavior; surface area semiconductor matrix; thermal conductivity; uniformly distributed thermoelectric nanoparticles; van der Pauw configuration; Composite materials; Conducting materials; Electric resistance; Geometry; Nanoparticles; Nanostructured materials; Semiconductor materials; Testing; Thermal conductivity; Thermoelectricity;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Thermoelectrics, 2005. ICT 2005. 24th International Conference on
ISSN :
1094-2734
Print_ISBN :
0-7803-9552-2
Type :
conf
DOI :
10.1109/ICT.2005.1519941
Filename :
1519941
Link To Document :
بازگشت