• DocumentCode
    2214180
  • Title

    Thermal Degradation of Insulating Systems Based on Dielectric Currents

  • Author

    Contin, Mario Celio

  • Author_Institution
    Motor Div., R&D Dept., WEG Equipamentos Eletr. S.A., Jaragua do Sul
  • fYear
    2008
  • fDate
    9-12 June 2008
  • Firstpage
    416
  • Lastpage
    419
  • Abstract
    This work presents the dielectric currents of insulating systems with its several components. It is a study about the physical nature of dielectric insulating materials with its effects of electric polarization when subjected to electric field influence. The main objective of this study is to show the dielectric insulating materials degradation speed dependency on temperature. A method is proposed to quantify the insulating system aging speed based on dielectric current measurements. It is presented the physical nature that causes the aging of the dielectric materials molecular structure based on the variation of the dielectric currents as a function of temperature. It is showed that the insulating system degradation speed becomes higher from a characteristic temperature value on and, that this value can be or not coincident with the thermal class temperature. The electric circuit arrangement used to measure the dielectric currents is presented. Finally, experimental results obtained with insulating systems of thermal classes B, F and H are presented, to demonstrate the application of the proposed method with the respective conclusions and comments.
  • Keywords
    dielectric materials; thermal insulating materials; dielectric current measurements; dielectric currents; dielectric insulating materials; electric polarization; molecular structure; thermal degradation; Aging; Circuits; Current measurement; Dielectric materials; Dielectric measurements; Dielectrics and electrical insulation; Electric variables measurement; Polarization; Temperature dependence; Thermal degradation;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electrical Insulation, 2008. ISEI 2008. Conference Record of the 2008 IEEE International Symposium on
  • Conference_Location
    Vancouver, BC
  • ISSN
    1089-084X
  • Print_ISBN
    978-1-4244-2091-9
  • Electronic_ISBN
    1089-084X
  • Type

    conf

  • DOI
    10.1109/ELINSL.2008.4570362
  • Filename
    4570362