DocumentCode :
2214272
Title :
An Estimation Technology of Temperature Rise in GIS Bus Bar using Three-Dimensional Coupled-Field Multiphysics
Author :
Yoon, Jeong-Hoon ; Ahn, Heui-Sub ; Choi, Jongung ; Oh, Il-Sung
Author_Institution :
Electrotechnol. R&D Center, LS Ind. Syst. Co. Ltd., Seoul
fYear :
2008
fDate :
9-12 June 2008
Firstpage :
432
Lastpage :
436
Abstract :
This paper shows the temperature rise of the high voltage GIS bus bar. The temperature rise in GIS bus bar is due to Joule´s losses in the conductor and the induced eddy current in the tank. The power losses of a bus bar calculated by the magnetic field analysis are used as the input data rise for the thermal analysis to predict the temperature. The required analysis is a couple-field Multiphysics that accounts for the interactions between three-dimensional AC harmonic magnetic and fluid fields. The heat transfer calculation using the fluid analysis is done by considering the natural convection and the radiation from the tank to the atmosphere. Consequently, because temperature distributions by couple-field Multiphysics (coupled magnetic-fluid) have good agreement with results of temperature rise test, the proposed couple-field Multiphysics technique is likely to be used in a conduction design of the single-pole and three pole-encapsulated bus bar in GIS.
Keywords :
busbars; eddy currents; gas insulated switchgear; heat transfer; 3D coupled-field multiphysics; AC harmonic magnetic; GIS bus bar; Joule loss; estimation technology; fluid fields; heat transfer; induced eddy current; Conductors; Couplings; Eddy currents; Geographic Information Systems; Harmonic analysis; Magnetic analysis; Magnetic fields; Magnetic liquids; Temperature distribution; Voltage; GIS bus bar; Joule´s losses; Radiation; conduction design; couple-field Multiphysics; eddy current; fluid field; natural convection; temperature rise; three-dimensional AC harmonic magnetic field;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electrical Insulation, 2008. ISEI 2008. Conference Record of the 2008 IEEE International Symposium on
Conference_Location :
Vancouver, BC
ISSN :
1089-084X
Print_ISBN :
978-1-4244-2091-9
Electronic_ISBN :
1089-084X
Type :
conf
DOI :
10.1109/ELINSL.2008.4570366
Filename :
4570366
Link To Document :
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