DocumentCode :
2214332
Title :
Research activities of thermoelectric micro-cooler in KIMM
Author :
Kim, O.J. ; Lee, K.H. ; Han, S.W. ; Ha, G.H. ; Kim, D.H. ; Yoon, W.H.
Author_Institution :
Korea Inst. of Machinery & Mater., Taijeon, South Korea
fYear :
2005
fDate :
19-23 June 2005
Firstpage :
331
Lastpage :
334
Abstract :
The research activities to develop a thermoelectric micro-cooler, conducted in Korea Institute of Machinery and Materials (KIMM), are briefly introduced. The final goal of this research is to develop the micro sized thermoelectric cooler with high ZT. In this paper, the related research topics or techniques, such as the three-dimensional numerical simulation using FEMLAB software by considering the electron-phonon thermal non-equilibrium near the interfaces in module, nano-indentation test to determine the mechanical properties of thin film or coating, application of percolation concept in the powdering process to improve the performance of thermoelectric material, RF magnetron sputtering process to make the thin films of bismuth and photo-acoustic technique to measure the thermal conductivity of thin film, are explained. The basic principles, test equipments and some intermediate results are presented.
Keywords :
bismuth; cooling; electron-phonon interactions; indentation; micromechanical devices; percolation; photoacoustic effect; sputter deposition; thermal conductivity; thermoelectric devices; thin films; Bi; FEMLAB software; RF magnetron sputtering process; bismuth thin films; coating; electron-phonon thermal non-equilibrium; nanoindentation test; percolation concept; photoacoustic technique; powdering process; thermal conductivity; thermoelectric microcooler; three-dimensional numerical simulation; Conducting materials; Machinery; Magnetic materials; Materials testing; Numerical simulation; Software performance; Software testing; Sputtering; Thermal conductivity; Thermoelectricity;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Thermoelectrics, 2005. ICT 2005. 24th International Conference on
ISSN :
1094-2734
Print_ISBN :
0-7803-9552-2
Type :
conf
DOI :
10.1109/ICT.2005.1519951
Filename :
1519951
Link To Document :
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