DocumentCode
2214446
Title
Grain structure and thermal transport properties of TiNiSn1-xSbx and Ti1-yZryNiSn0.95Sb0.05 half-Heusler alloys
Author
Bhattacharya, S. ; Skove, M.J. ; Russell, Meredith ; Tritt, Terry M. ; Xia, Y. ; Ponnambalam, V. ; Poon, S.J. ; Thadhani, N.
Author_Institution
Clemson Univ., SC, USA
fYear
2005
fDate
19-23 June 2005
Firstpage
355
Lastpage
359
Abstract
Thermal conductivity of two series of Ti-based half-Heusler alloys have been investigated and compared. A significant reduction in the lattice thermal conductivity (κL) in Ti1-yZryNiSn0.95Sb0.05 via mass fluctuation scattering (y>20%) is observed. However, small amounts of Sb (x≤5%) in TiNiSn1-xSbx do not yield similar results. A non-systematic increase in κL in the TiNiSn1-xSbx series was observed, even with the amounts (x≤5%) of Sb-doping. Extensive investigations of the grain structure in these materials show that there is a direct correlation between κL and the average grain size in these materials. These results are in good agreement with the theoretical predictions of Goldsmid et al. Theoretical calculations relating to the phonon mean free path in both the series of compounds would also be presented and discussed.
Keywords
antimony alloys; crystal microstructure; nickel alloys; phonons; thermal conductivity; tin alloys; titanium alloys; zirconium alloys; Ti1-yZryNiSn0.95Sb0.05; TiNiSn1-xSbx; grain size; grain structure; half-Heusler alloys; mass fluctuation scattering; phonon mean free path; thermal conductivity; Fluctuations; Lattices; Nickel alloys; Phonons; Photonic band gap; Scattering; Thermal conductivity; Tin alloys; Titanium alloys; Zirconium;
fLanguage
English
Publisher
ieee
Conference_Titel
Thermoelectrics, 2005. ICT 2005. 24th International Conference on
ISSN
1094-2734
Print_ISBN
0-7803-9552-2
Type
conf
DOI
10.1109/ICT.2005.1519957
Filename
1519957
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