DocumentCode
2214462
Title
Building-In Reliability: Development Through Manufacturing
Author
Marcoux, P.J.
Author_Institution
Hewlett Packard Company
fYear
1993
fDate
24-27 Oct 1993
Firstpage
189
Lastpage
195
Keywords
Cause effect analysis; Costs; Degradation; Electrostatic discharge; Integrated circuit reliability; MOSFET circuits; Manufacturing processes; Packaging; Semiconductor device manufacture; Testing;
fLanguage
English
Publisher
ieee
Conference_Titel
Integrated Reliability Workshop Final Report, 1993 International
Type
conf
DOI
10.1109/IRWS.1993.666309
Filename
666309
Link To Document