DocumentCode :
2214484
Title :
The benefits of 3D networks-on-chip as shown with LDPC decoding
Author :
Mineo, Christopher ; Davis, W. Rhett
Author_Institution :
Dept. of Electr. & Comput. Eng., North Carolina State Univ., Raleigh, NC, USA
fYear :
2009
fDate :
28-30 Sept. 2009
Firstpage :
1
Lastpage :
8
Abstract :
In this work we describe our network-on-chip (NoC) simulator, which fills the gap between architectural level and circuit level NoC simulation. The core is a fast, high level transaction-based NoC simulator, which accesses carefully compiled power, timing, and area models for basic NoC components built from detailed circuit simulation. It makes use of the architectural evaluator, which performs a detailed global interconnect analysis within the framework of industry-standard design tools. Using low density parity check decoding as a test vehicle, the NoC simulator is used in an NoC design study comparing 2D and 3D integrated circuits, and shows a method by which on-chip networks can be optimized.
Keywords :
circuit simulation; integrated circuit modelling; network-on-chip; parity check codes; 2D integrated circuits; 3D integrated circuits; 3D networks-on-chip; LDPC decoding; circuit level NoC simulation; global interconnect analysis; on-chip networks; transaction-based NoC simulator; Circuit simulation; Circuit testing; Decoding; Integrated circuit interconnections; Integrated circuit testing; Network-on-a-chip; Parity check codes; Performance analysis; Performance evaluation; Timing;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
3D System Integration, 2009. 3DIC 2009. IEEE International Conference on
Conference_Location :
San Francisco, CA
Print_ISBN :
978-1-4244-4511-0
Electronic_ISBN :
978-1-4244-4512-7
Type :
conf
DOI :
10.1109/3DIC.2009.5306585
Filename :
5306585
Link To Document :
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