DocumentCode :
2214639
Title :
Maximum power estimation for sequential circuits using a test generation based technique
Author :
Wang, Chuan-Yu ; Roy, Kaushik ; Chou, Tan-Li
Author_Institution :
Dept. of Electr. & Comput. Eng., Purdue Univ., West Lafayette, IN, USA
fYear :
1996
fDate :
5-8 May 1996
Firstpage :
229
Lastpage :
232
Abstract :
With the high demand for reliability and performance, accurate estimation of maximum instantaneous power dissipation in CMOS circuits is essential to determine the IR drop on supply lines and optimizing the power and ground routing. However, the problem of determining the input patterns to induce maximum current, and hence, the maximum power, is NP-complete. In this paper, we present an Automatic Test Generation (ATG) based technique to efficiently estimate maximum power dissipation in sequential circuits. The technique can generate tight lower bounds of maximum instantaneous power within very short CPU time compared to random simulation based techniques. In addition, we also generate the measure of the quality or effectiveness of our approach from, a statistical point of view. Experiments were performed on ISCAS-89 sequential circuit benchmarks. Results show that the ATG-based estimation is superior to traditional simulation-based technique in both speed and performance. For large circuits, the ATG approach is on an average 29% better and 37099% faster than simulation based technique
Keywords :
CMOS logic circuits; automatic testing; integrated circuit testing; logic testing; sequential circuits; ATG-based estimation; CMOS circuit; IR drop; NP-complete problem; automatic test generation; maximum instantaneous power dissipation; sequential circuit; Central Processing Unit; Circuit simulation; Circuit testing; Power dissipation; Power generation; Power system reliability; Sequential analysis; Sequential circuits; Switching circuits; Upper bound;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Custom Integrated Circuits Conference, 1996., Proceedings of the IEEE 1996
Conference_Location :
San Diego, CA
Print_ISBN :
0-7803-3117-6
Type :
conf
DOI :
10.1109/CICC.1996.510549
Filename :
510549
Link To Document :
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