Title :
3-D memory organization and performance analysis for multi-processor network-on-chip architecture
Author :
Weldezion, Awet Yemane ; Lu, Zhonghai ; Weerasekera, Roshan ; Tenhunen, Hannu
Author_Institution :
Dept. of Electron., Comput., & Software Syst., KTH R. Inst. of Technol., Kista, Sweden
Abstract :
Several forms of processor memory organizations have been in use to optimally access off-chip memory systems mainly the hard disk drives (HDD). Recent trends show that the solid state drives (SSD) such as flash memories replacing HDDs and multi-processor memory system realized in a single 3-D structure with network-on-chip (NOC) architecture as a communication medium. This paper discusses high level memory organization and architectural modeling and simulation based on 3D NOC. A comparative analysis among several models including Dance-hall, Sandwich, Terminal, Per-layer and mixed architectures is done. Simulations in cycle accurate 3-D NOC VHDL model are done to evaluate the performance each architecture in uniform and local traffic patterns.
Keywords :
microprocessor chips; network-on-chip; 3D memory organization; Dance-hall; Per-layer; Sandwich; Terminal; flash memories; hard disk drives; multiprocessor network-on-chip architecture; off-chip memory systems; processor memory organizations; solid state drives; Network-on-a-chip; Performance analysis;
Conference_Titel :
3D System Integration, 2009. 3DIC 2009. IEEE International Conference on
Conference_Location :
San Francisco, CA
Print_ISBN :
978-1-4244-4511-0
Electronic_ISBN :
978-1-4244-4512-7
DOI :
10.1109/3DIC.2009.5306593