DocumentCode
2214787
Title
Development of Functionally innovative 3D-Integrated Circuit (Dream Chip) technology / High-Density 3D-Integration Technology for Multifunctional Devices
Author
Kada, Morihiro
Author_Institution
3D-Integration Technol. Res. Dept., Assoc. of Super-Adv. Electron. Technol., Tokyo, Japan
fYear
2009
fDate
28-30 Sept. 2009
Firstpage
1
Lastpage
6
Abstract
In the NEDO ldquoDream Chip Projectrdquo, ASET has been entrusted a project for developing, ldquoHigh-Density 3D-Integration Technology for Multifunctional Devicesrdquo. In the five year project from 2008 to 2012, development on technologies for design environment, interposer, chip test, cooling and stacking/bonding, thin wafer, and development on demonstration device and process are being performed.
Keywords
integrated circuit design; 3D-integrated circuit technology; dream chip technology; high-density 3D-integration technology; multifunctional devices; Analytical models; Circuit simulation; Delay effects; Electromagnetic fields; Energy consumption; Engines; Field programmable gate arrays; Magnetic circuits; Three-dimensional integrated circuits; Wiring;
fLanguage
English
Publisher
ieee
Conference_Titel
3D System Integration, 2009. 3DIC 2009. IEEE International Conference on
Conference_Location
San Francisco, CA
Print_ISBN
978-1-4244-4511-0
Electronic_ISBN
978-1-4244-4512-7
Type
conf
DOI
10.1109/3DIC.2009.5306596
Filename
5306596
Link To Document