3D integrated circuits for lab-on-chip applications

Author

Dickerson, Samuel J. ; Levitan, Steven P. ; Chiarulli, Donald M.

Author_Institution

Dept. of Electr. & Comput. Eng., Univ. of Pittsburgh, Pittsburgh, PA, USA

fYear

2009

fDate

28-30 Sept. 2009

Firstpage

1

Lastpage

8

Abstract

We present the designs of two new lab-on-chip devices that use 3D integrated circuit technology to support the separation, purification, and assay of biological particles. Our technique is based on a nanoscale implementation of dielectrophoresis. The key feature of our designs is the use of fabrication features found in 3D technology to create on-chip, nanoscale electrode arrays. The capabilities of our designs are demonstrated with multi-physics simulations of the chips sorting heterogeneous mixtures of HSV-1 capsids.

Keywords

electrophoresis; integrated circuits; lab-on-a-chip; nanotechnology; 3D integrated circuits; HSV-1 capsids; dielectrophoresis; fabrication; lab-on-chip; nanoscale implementation; Application software; Dielectrophoresis; Electrodes; Frequency; Integrated circuit technology; Nanobioscience; Nonuniform electric fields; Polarization; Purification; Three-dimensional integrated circuits; 3D integrated circuits; Bio-chip; Cytometry; Dielectrophoresis; Lab-on-chip;

fLanguage

English

Publisher

ieee

Conference_Titel

3D System Integration, 2009. 3DIC 2009. IEEE International Conference on

Conference_Location

San Francisco, CA

Print_ISBN

978-1-4244-4511-0

Electronic_ISBN

978-1-4244-4512-7

Type

conf

DOI

10.1109/3DIC.2009.5306597

Filename

5306597