DocumentCode :
2214890
Title :
Thermoelectric properties and microstructure of Co-doped iron-silicides mixed with Ag or Cu
Author :
Hasaka, M. ; Morimura, T. ; Watanabe, T. ; Etoh, Y. ; Nakashima, H.
Author_Institution :
Dept. of Mater. Sci. & Eng., Nagasaki Univ., Japan
fYear :
2005
fDate :
19-23 June 2005
Firstpage :
419
Lastpage :
422
Abstract :
Spin-cast ribbons and sintered discs of the Co-doped iron disilicides mixed with Ag or Cu were prepared and investigated by measuring the Seebeck coefficient, electrical conductivity, power factor, dimensionless figure of merit, and thermal conductivity at 300 K. The microstructure was characterized by powder X-ray diffraction analysis and transmission electron microscopic analysis. The ribbons and bulks possess an n-type of polarity. The Seebeck coefficient, electrical conductivity, power factor, dimensionless figure of merit, and thermal conductivity depend on the Si, Ag, or Cu content. The thermoelectric properties differ from the ribbons to the discs. The Ag or Cu phase disperses at grain boundaries and matrix of the β phase, and contributes to form the β phase, and is effective to improve the thermoelectric properties.
Keywords :
Seebeck effect; X-ray diffraction; cobalt alloys; copper alloys; electrical conductivity; grain boundaries; iron alloys; silicon alloys; silver alloys; thermal conductivity; transmission electron microscopy; (Fe0.97Co0.03Six)100-y-zAgyCuz; 300 K; Co-doped iron-silicides; Seebeck coefficient; dimensionless figure of merit; electrical conductivity; grain boundaries; microstructure; powder X-ray diffraction; power factor; sintered discs; spin-cast ribbons; thermal conductivity; thermoelectric properties; transmission electron microscopy; Conductivity measurement; Electric variables measurement; Iron; Microstructure; Powders; Power measurement; Reactive power; Thermal conductivity; Thermal factors; Thermoelectricity;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Thermoelectrics, 2005. ICT 2005. 24th International Conference on
ISSN :
1094-2734
Print_ISBN :
0-7803-9552-2
Type :
conf
DOI :
10.1109/ICT.2005.1519976
Filename :
1519976
Link To Document :
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