Title :
Table of contents
Abstract :
The following topics are dealt with: copper through silicon vias; die-to-wafer direct bonding and planarization; MEMS-LSI multi-chip module; high energy physics; 3D-integrated circuit technology; multi-processor network-on-chip; and NAND flash memories.
Keywords :
copper; flash memories; large scale integration; logic design; micromechanical devices; network-on-chip; silicon; wafer-scale integration; 3D-integrated circuit technology; MEMS-LSI multichip module; NAND flash memories; copper; die-to-wafer direct bonding; die-to-wafer direct planarization; high energy physics; multiprocessor network-on-chip; through-silicon vias;
Conference_Titel :
3D System Integration, 2009. 3DIC 2009. IEEE International Conference on
Conference_Location :
San Francisco, CA
Print_ISBN :
978-1-4244-4511-0
DOI :
10.1109/3DIC.2009.5306601
