DocumentCode :
2214962
Title :
Electron channeling X-ray microanalysis for site occupation of the additional element in half-Heusler
Author :
Morimura, T. ; Hasaka, M. ; Kondo, S.
Author_Institution :
Graduate Sch. of Sci. & Technol., Nagasaki Univ., Japan
fYear :
2005
fDate :
19-23 June 2005
Firstpage :
430
Lastpage :
433
Abstract :
The site occupancy of Sb atoms in a thermoelectric material TiNiSn0.9Sb0.1 with the half-Heusler structure was analyzed by measuring characteristic X-ray intensities at various electron incident directions in a transmission electron microscope (TEM). This technique is called the method for determining atomic locations by channeling enhanced microanalysis (ALCHEMI). The incident electron intensities in half-Heusler structure calculated by dynamical electron diffraction theory were compared with the measured characteristic X-ray intensities. The measured characteristic X-ray intensity for each element changed together with the change of incident electron intensities, depending on the electron incident directions. From the dependence of the X-ray intensities, the distribution fractions of Sb atoms on each site were quantitatively clarified. As a result, the distribution fractions of Sb atoms on Ti, Ni and Sn sites were shown to be -0.07, 0.12 and 0.95, respectively.
Keywords :
X-ray analysis; antimony alloys; channelling; nickel alloys; thermoelectricity; tin alloys; titanium alloys; transmission electron microscopy; TEM; TiNiSn0.9Sb0.1; atomic locations by channeling enhanced microanalysis; dynamical electron diffraction theory; electron channeling X-ray microanalysis; half-Heusler structure; site occupancy; thermoelectric material; transmission electron microscope; Argon; Atomic measurements; Doping; Hafnium; Materials science and technology; Pollution measurement; Thermoelectricity; Tin; Transmission electron microscopy; Zirconium;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Thermoelectrics, 2005. ICT 2005. 24th International Conference on
ISSN :
1094-2734
Print_ISBN :
0-7803-9552-2
Type :
conf
DOI :
10.1109/ICT.2005.1519979
Filename :
1519979
Link To Document :
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