DocumentCode
2215253
Title
ErAs/InGaAs superlattice Seebeck coefficient
Author
Zeng, Gehong ; Bowers, John E. ; Zhang, Yan ; Shakouri, Ali ; Zide, Joshua ; Gossard, Arthur ; Kim, Woochul ; Majumdar, Arun
Author_Institution
Dept. of Electr. & Comput. Eng., California Univ., Santa Barbara, CA, USA
fYear
2005
fDate
19-23 June 2005
Firstpage
500
Lastpage
503
Abstract
InGaAs with embedded ErAs nano-particles is a promising material for thermoelectric applications. The incorporation of erbium arsenide metallic nanoparticles into the semiconductor can provide both charge carriers and create scattering centers for phonons. Electron filtering by heterostructure barriers can also enhance Seebeck coefficient by selective emission of hot electrons. 2.1 μm-thick ErAs/InGaAs superlattices with a period of 10 nm InAlGaAs and 20 nm InGaAs were grown using molecular beam epitaxy, and the effective doping is from 2×1018 to 1×1019 cm-3. Special device patterns were developed for the measurement of the cross-plane Seebeck coefficient of the superlattice layers. Using these device patterns, the combined Seebeck coefficient of superlattice and the substrate were measured and the temperature drops through the superlattice and InP substrate were determined with 3D ANSYS® simulations. The Seebeck coefficient of the superlattice layers is obtained based on the measurements and simulation results.
Keywords
III-V semiconductors; Seebeck effect; aluminium compounds; erbium compounds; gallium arsenide; hot carriers; indium compounds; molecular beam epitaxial growth; nanoparticles; semiconductor doping; semiconductor superlattices; 10 nm; 2.1 micron; 20 nm; InAlGaAs-InGaAs; InGaAs-ErAs; InP; Seebeck coefficient; charge carriers; electron filtering; heterostructure barriers; hot electrons; metallic nanoparticles; molecular beam epitaxy; phonons; superlattice; Electron beams; Electron emission; Erbium; Indium gallium arsenide; Nanoparticles; Semiconductor materials; Semiconductor superlattices; Substrates; Temperature measurement; Thermoelectricity;
fLanguage
English
Publisher
ieee
Conference_Titel
Thermoelectrics, 2005. ICT 2005. 24th International Conference on
ISSN
1094-2734
Print_ISBN
0-7803-9552-2
Type
conf
DOI
10.1109/ICT.2005.1519992
Filename
1519992
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