DocumentCode :
2215273
Title :
Revealing Metal Corrosion Failures Using Wafer Level Temperature Cycle Stress Testing
Author :
Duffalo, Joseph M. ; Staszkow, Joseph E. ; Chan, Jeffrey A. ; Egelhoff, Philip D. ; Pollack, Howard A. ; Shah, Piyush M.
Author_Institution :
Motorola
fYear :
1993
fDate :
24-27 Oct 1993
Firstpage :
201
Lastpage :
202
Keywords :
Application specific integrated circuits; Circuit testing; Corrosion; Failure analysis; Integrated circuit testing; Packaging; Semiconductor device modeling; Temperature distribution; Thermal stresses; Weibull distribution;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Integrated Reliability Workshop Final Report, 1993 International
Type :
conf
DOI :
10.1109/IRWS.1993.666312
Filename :
666312
Link To Document :
https://search.ricest.ac.ir/dl/search/defaultta.aspx?DTC=49&DC=2215273
