• DocumentCode
    2215273
  • Title

    Revealing Metal Corrosion Failures Using Wafer Level Temperature Cycle Stress Testing

  • Author

    Duffalo, Joseph M. ; Staszkow, Joseph E. ; Chan, Jeffrey A. ; Egelhoff, Philip D. ; Pollack, Howard A. ; Shah, Piyush M.

  • Author_Institution
    Motorola
  • fYear
    1993
  • fDate
    24-27 Oct 1993
  • Firstpage
    201
  • Lastpage
    202
  • Keywords
    Application specific integrated circuits; Circuit testing; Corrosion; Failure analysis; Integrated circuit testing; Packaging; Semiconductor device modeling; Temperature distribution; Thermal stresses; Weibull distribution;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Integrated Reliability Workshop Final Report, 1993 International
  • Type

    conf

  • DOI
    10.1109/IRWS.1993.666312
  • Filename
    666312
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=2215273