DocumentCode :
2216412
Title :
Multichip Modules: Packaging Solutions for Size Performance Integration
Author :
Vasquez, Barbara ; Tippins, Fred
Author_Institution :
Motorola
fYear :
1993
fDate :
24-27 Oct 1993
Firstpage :
215
Lastpage :
217
Keywords :
Automatic testing; Bismuth; Costs; Materials reliability; Materials testing; Multichip modules; Packaging; Space technology; Temperature; Wafer scale integration;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Integrated Reliability Workshop Final Report, 1993 International
Type :
conf
DOI :
10.1109/IRWS.1993.666317
Filename :
666317
Link To Document :
https://search.ricest.ac.ir/dl/search/defaultta.aspx?DTC=49&DC=2216412
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