DocumentCode
2216493
Title
Testing and analysis of lifetime of a vertical bulk MEMS switch
Author
Miao, Lu ; Zhengping, Zhao ; Xiaodong, Hu ; Hejun, Guo ; Zou Xuefeng ; Yanqing, Liu ; Yong, Yang
Author_Institution
Hebei Semicond. Res. Inst. (HSRI), China
Volume
2
fYear
2001
fDate
22-25 Oct. 2001
Firstpage
765
Abstract
A single crystal silicon cantilever, bulk MEMS vertical switch is presented. Multi-way switches based on the above structure were fabricated for application in the area of computer aided testing. As the sticking point of MEMS switches, operating lifetime must be first considered. Dynamic testing was imposed on such a switch until its failure. Then analysis of the failure mechanism is given. As the conclusion, heat accumulation is demonstrated as the reason for failure.
Keywords
dynamic testing; elemental semiconductors; failure analysis; microswitches; silicon; bulk MEMS vertical switch; computer aided testing; dynamic testing; failure mechanism; heat accumulation; multiway switches; operating lifetime; single crystal silicon cantilever; Contacts; Electrodes; Fabrication; Failure analysis; Life testing; Micromechanical devices; Resonance; Silicon; Stress; Switches;
fLanguage
English
Publisher
ieee
Conference_Titel
Solid-State and Integrated-Circuit Technology, 2001. Proceedings. 6th International Conference on
Print_ISBN
0-7803-6520-8
Type
conf
DOI
10.1109/ICSICT.2001.982007
Filename
982007
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