DocumentCode
2216602
Title
Research on visual detection technology using eddy current magnet excitation device
Author
Cheng, Yuhua ; Rong, Ke
Author_Institution
Sch. of Autom. Eng., Univ. of Electron. Sci. & Technol. of China, Chengdu, China
fYear
2009
fDate
25-27 Sept. 2009
Firstpage
149
Lastpage
151
Abstract
A visual method for detecting invisible and buried micro-flaws under fine metallic surface is described. A new magneto-optic microscope that has a laser source, a CCD camera, and an eddy current magnet excitation device is developed for this work. A pulse generator supplies an intermittent square pulse to induce the magnet excitation device, which can intensify eddy currents yet reduce the working temperature of the exciting coil and specimens. The magnetic field variation produced by the imbedded defect causes a rotation of the polarization plane of the reflected beam. Therefore the reflected beam carries an image of the defect, which is received by a CCD camera. Now the imperceptible flaws in subsurface of mental product are visually tested. Image edge processing approaches are designed to enhance the effect. Experimental tests have been done and the method presented is evaluated by the experimental results.
Keywords
CCD image sensors; eddy current testing; flaw detection; image processing; magneto-optical devices; pulse generators; CCD camera; eddy current magnet excitation device; fine metallic surface; image edge processing; imbedded defect; laser source; magneto-optic microscope; mental product subsurface; microflaws; pulse generator; reflected beam polarization plane; visual detection technology; Charge coupled devices; Charge-coupled image sensors; Eddy currents; Laser excitation; Magnetic devices; Magnetic force microscopy; Magnetooptic devices; Magnetooptic effects; Pulse generation; Testing; eddy current; image processing; magnet excitation device; magneto-optic microscope;
fLanguage
English
Publisher
ieee
Conference_Titel
Applied Superconductivity and Electromagnetic Devices, 2009. ASEMD 2009. International Conference on
Conference_Location
Chengdu
Print_ISBN
978-1-4244-3686-6
Electronic_ISBN
978-1-4244-3687-3
Type
conf
DOI
10.1109/ASEMD.2009.5306673
Filename
5306673
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