Title :
Vacuum arc deposition of TiN and TiOx films on large metallic and dielectric surfaces
Author :
Borisov, D.P. ; Koval, N.N. ; Kovsharov, N.F. ; Tolkachev, V.S. ; Schanin, P.M.
Author_Institution :
High Current Electron. Inst., Acad. of Sci., Tomsk, Russia
Abstract :
Plasma-assisted vacuum deposition of TiN and TiOx films is performed using four vacuum arc evaporators and four hot-cathode-arc plasma generators. Film deposition on substrates of total area 6 m2 , with the workpiece having dimensions of 1×1.6 m, is completed in one cycle. The arc parameters in the process of film deposition are typically as follows: the vacuum arc current and voltage are 100 A and 30 V, respectively, and the hot-cathode arc current and voltage are 20 A and 50 V, respectively. The deposition of a TiN film on a metal takes 50 min, while the TiN or TiOx film deposition on a dielectric occurs within 20 min
Keywords :
ceramics; titanium compounds; vacuum deposited coatings; vacuum deposition; 100 A; 20 A; 20 min; 30 V; 50 V; 50 min; TiN; TiN films; TiO; TiOx films; large dielectric substrates; large metallic substrates; vacuum arc current; Argon; Atomic layer deposition; Cathodes; Dielectric substrates; Large Hadron Collider; Plasma density; Surface discharges; Tin; Vacuum arcs; Vacuum systems;
Conference_Titel :
Discharges and Electrical Insulation in Vacuum, 1996. Proceedings. ISDEIV., XVIIth International Symposium on
Conference_Location :
Berkeley, CA
Print_ISBN :
0-7803-2906-6
DOI :
10.1109/DEIV.1996.545489
