• DocumentCode
    2216636
  • Title

    Vacuum arc deposition of TiN and TiOx films on large metallic and dielectric surfaces

  • Author

    Borisov, D.P. ; Koval, N.N. ; Kovsharov, N.F. ; Tolkachev, V.S. ; Schanin, P.M.

  • Author_Institution
    High Current Electron. Inst., Acad. of Sci., Tomsk, Russia
  • Volume
    2
  • fYear
    1996
  • fDate
    21-26 Jul 1996
  • Firstpage
    881
  • Abstract
    Plasma-assisted vacuum deposition of TiN and TiOx films is performed using four vacuum arc evaporators and four hot-cathode-arc plasma generators. Film deposition on substrates of total area 6 m2 , with the workpiece having dimensions of 1×1.6 m, is completed in one cycle. The arc parameters in the process of film deposition are typically as follows: the vacuum arc current and voltage are 100 A and 30 V, respectively, and the hot-cathode arc current and voltage are 20 A and 50 V, respectively. The deposition of a TiN film on a metal takes 50 min, while the TiN or TiOx film deposition on a dielectric occurs within 20 min
  • Keywords
    ceramics; titanium compounds; vacuum deposited coatings; vacuum deposition; 100 A; 20 A; 20 min; 30 V; 50 V; 50 min; TiN; TiN films; TiO; TiOx films; large dielectric substrates; large metallic substrates; vacuum arc current; Argon; Atomic layer deposition; Cathodes; Dielectric substrates; Large Hadron Collider; Plasma density; Surface discharges; Tin; Vacuum arcs; Vacuum systems;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Discharges and Electrical Insulation in Vacuum, 1996. Proceedings. ISDEIV., XVIIth International Symposium on
  • Conference_Location
    Berkeley, CA
  • Print_ISBN
    0-7803-2906-6
  • Type

    conf

  • DOI
    10.1109/DEIV.1996.545489
  • Filename
    545489