• DocumentCode
    2216877
  • Title

    The structural and dielectric properties of sandwiched PZT thin films

  • Author

    Nam, Sung-Pill ; Lee, Sung-gap ; Bae, Seong-Gi ; Lee, Young-Hie

  • Author_Institution
    Dept. of Electron. Mater. Eng., Kwangwoon Univ., Seoul
  • Volume
    1
  • fYear
    2006
  • fDate
    22-25 Oct. 2006
  • Firstpage
    632
  • Lastpage
    633
  • Abstract
    The sandwiched Pb1.1(Zr0.4Ti0.6)O3/Pb1.1(Zr0.6Ti0.4)O3/Pb1.1(Zr0.4Ti0.6)O3 [PZT(4060)/(6040)/(4060)] thin films were deposited by RF sputtering method on the Pt/TiO2/SiO2/Si substrate. We investigated the effects of deposition conditions on the structural and electrical properties of sandwiched PZT thin films. All sandwiched PZT thin films show dense and homogeneous structure without the presence of the rosette structure. The dielectric properties such as dielectric constant, loss, remanent polarization and leakage current density of the sandwich PZT thin film were superior to those of single composition PZT(4060) and PZT(6040) films, and those values for the sandwiched PZT thin film annealed at 650degC were 913, 3.06%, 15.2 muC/cm2 and 2.57times10-9 A/cm2 at 5 V. This study suggests that the design of the sandwiched PZT thin films capacitor with tetragonal and rhombohedral phase should be an effective method to enhance the dielectric and ferroelectric performance in devices.
  • Keywords
    current density; lead compounds; leakage currents; permittivity; sandwich structures; sputter deposition; zirconium compounds; RF sputtering method; dielectric constant; dielectric properties; homogeneous structure; leakage current density; polarization; rosette structure; sandwiched PZT thin films; Dielectric constant; Dielectric devices; Dielectric losses; Dielectric substrates; Dielectric thin films; Radio frequency; Semiconductor thin films; Sputtering; Thin film devices; Zirconium; Dielectric property; Ferroelectric; MPB; Sandwich; Thin film;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Nanotechnology Materials and Devices Conference, 2006. NMDC 2006. IEEE
  • Conference_Location
    Gyeongju
  • Print_ISBN
    978-1-4244-0540-4
  • Electronic_ISBN
    978-1-4244-0541-1
  • Type

    conf

  • DOI
    10.1109/NMDC.2006.4388938
  • Filename
    4388938