Title :
Influences of various dielectrics materials on p++ silicon diaphragm
Author :
Wu, Junmiao ; Zou, Deshu ; Gao, Guo ; Li, Lan ; Niu, Nanhui ; Shen, Guangdi
Author_Institution :
Electron. Eng. Dept., Beijing Polytech. Univ., China
Abstract :
Effects of various dielectric materials on thermal stress in p++ silicon diaphragm were analyzed. In this work the modeling of thin film deposition based on the finite element analysis (FEA) is described. The theoretical results predict the change of mechanical performance when various dielectric materials were deposited on p++ silicon diaphragm.
Keywords :
boron; diaphragms; dielectric materials; dielectric thin films; elemental semiconductors; finite element analysis; pressure sensors; silicon; thermal stresses; FEA; Si:B; dielectrics materials; finite element analysis; mechanical performance; p++ silicon diaphragm; pressure sensor; thermal stress; thin film deposition; Biosensors; Boron; Dielectric devices; Dielectric materials; Etching; Mechanical sensors; Silicon; Tensile stress; Thermal expansion; Thermal stresses;
Conference_Titel :
Solid-State and Integrated-Circuit Technology, 2001. Proceedings. 6th International Conference on
Print_ISBN :
0-7803-6520-8
DOI :
10.1109/ICSICT.2001.982022
