DocumentCode :
2216928
Title :
Nanomaterial fabrication by Ru atomic layer deposition on anodic aluminum oxide nanotemplate
Author :
Woo-Hee Kim ; Park, Sang-Joon ; Kim, H.
Author_Institution :
Dept. of Mater. Sci. & Eng., POSTECH, Pohang
Volume :
1
fYear :
2006
fDate :
22-25 Oct. 2006
Firstpage :
636
Lastpage :
637
Abstract :
Ru Atomic layer deposition (ALD) and anodic aluminum oxide (AAO) process were studied for fabrication of one dimensional metallic nanostructure. Low resistivity and very pure ruthenium thin films were deposited from bis(ethylcyclopentadienyl)ruthenium [Ru(EtCp)2] by thermal atomic layer deposition (ALD) using oxygen (O2) gas and plasma-enhanced ALD (PE-ALD) using ammonia (NH3) plasma. In addition, regularly ordered porous anodic aluminum oxide nanotemplates were fabricated on aluminum plate and Al film by multistep-step anodization method. The process conditions for Ru ALD process to fabricate metallic nanostructure by filling the nanotemplates were investigated.
Keywords :
aluminium compounds; anodisation; atomic layer deposition; nanoporous materials; nanotechnology; ruthenium; thin films; Ru atomic layer deposition; ammonia plasma; bis(ethylcyclopentadienyl)ruthenium; metallic nanostructure; multistep-step anodization method; nanomaterial fabrication; oxygen gas; plasma-enhanced ALD; porous anodic aluminum oxide nanotemplates; ruthenium thin films; thermal atomic layer deposition; Aluminum oxide; Argon; Atomic layer deposition; Conductivity; Fabrication; Plasma temperature; Semiconductor films; Sputtering; Substrates; Thermal resistance; AAO; atomic layer deposition; ruthenium;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Nanotechnology Materials and Devices Conference, 2006. NMDC 2006. IEEE
Conference_Location :
Gyeongju
Print_ISBN :
978-1-4244-0540-4
Electronic_ISBN :
978-1-4244-0541-1
Type :
conf
DOI :
10.1109/NMDC.2006.4388940
Filename :
4388940
Link To Document :
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