DocumentCode :
2217106
Title :
The deposition of TiN thin films by energetic condensation from a filtered cathodic arc process
Author :
Martin, P.J. ; Bendavid, A. ; Kinder, T.J.
Author_Institution :
Div. of Appl. Phys., CSIRO, Lindfield, NSW, Australia
Volume :
2
fYear :
1996
fDate :
21-26 Jul 1996
Firstpage :
887
Abstract :
A filtered cathodic arc source has been used to deposit thin films of titanium nitride. The properties of the films are influenced by the nature of the condensation process. TiN films may be deposited directly onto heated substrates in a nitrogen atmosphere or onto unbiased substrates at ambient temperature by condensing the Ti+ ion beam under 500 eV N2+ nitrogen ion bombardment. In the latter case the film stoichiometry was varied from a N:Ti ratio of 0.8 to 1.2 by controlling the relative arrival rates of Ti and nitrogen ions. Simple models are used to describe the evolution of compressive stress as a function of arrival ratio, and the composition of the ion assisted TiN films
Keywords :
ceramics; condensation; ion beam applications; stoichiometry; stress analysis; titanium compounds; vacuum deposited coatings; vacuum deposition; 500 eV; N2; TiN; TiN thin films; compressive stress evolution; energetic condensation; film stoichiometry; filtered cathodic arc process; ion assisted TiN films composition; Cathodes; Ion beams; Nitrogen; Physics; Semiconductor films; Sputtering; Substrates; Tin; Titanium; Vacuum arcs;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Discharges and Electrical Insulation in Vacuum, 1996. Proceedings. ISDEIV., XVIIth International Symposium on
Conference_Location :
Berkeley, CA
Print_ISBN :
0-7803-2906-6
Type :
conf
DOI :
10.1109/DEIV.1996.545491
Filename :
545491
Link To Document :
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