DocumentCode :
2217147
Title :
Wafer Level Reliability Competitiveness And Implementation Issues
Author :
Hoang, H.H.
fYear :
1993
fDate :
24-27 Oct 1993
Firstpage :
223
Lastpage :
227
Keywords :
Condition monitoring; Fabrication; Failure analysis; Integrated circuit packaging; Integrated circuit testing; Manufacturing processes; Product design; Production; Semiconductor device manufacture; Semiconductor device reliability;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Integrated Reliability Workshop Final Report, 1993 International
Type :
conf
DOI :
10.1109/IRWS.1993.666320
Filename :
666320
Link To Document :
https://search.ricest.ac.ir/dl/search/defaultta.aspx?DTC=49&DC=2217147
