Title :
Unintended passive resonant structures in interconnect designs for multi-gigabit signaling
Author :
Xiao, Kai ; Hock, Joe ; Bissonette, Bill ; Ye, Xiaoning
Author_Institution :
Intel Corp., DuPont, WA, USA
Abstract :
In a computer system design, printed-circuit board (PCB) and package designers may unknowingly ignore critical high-Q resonate phenomena. This is often associated with structures that are not direct part of the intended signaling path and/or not actively included in a typical signal integrity analysis. An example of the detrimental resonance impact due to an improperly terminated “no-connect” pin reveals a new class of problems associated with multi-gigabit signaling.
Keywords :
electronics packaging; printed circuit interconnections; signalling; PCB; computer system design; critical high-Q resonate phenomena; intended signaling path; interconnect designs; multigigabit signaling; package designers; printed-circuit board; signal integrity analysis; unintended passive resonant structures; Crosstalk; Pins; Resonant frequency; Scattering parameters; Sockets; Time domain analysis;
Conference_Titel :
Electromagnetic Compatibility (EMC), 2012 IEEE International Symposium on
Conference_Location :
Pittsburgh, PA
Print_ISBN :
978-1-4673-2061-0
DOI :
10.1109/ISEMC.2012.6351675