Title :
A novel planar level chip interconnection for unpackaged MMICs in the millimeter wave frequency range
Author :
Poprawa, Florian ; Ziroff, Andreas ; Schindler, Christina ; Zanati, Abdellatif ; Ellinger, Frank
Author_Institution :
Siemens AG Corp. Technol., Munich, Germany
Abstract :
This paper presents a novel planar interconnection technology for unpackaged monolithic microwave integrated circuits (MMICs), which work in the millimeter wave (mmw) frequency range. Compared to standard wire bonding, the new technique provides considerable advantages with regard to the electrical characteristics and manufacturing processes. The manufacturing process for a module containing surface mounted devices (SMD) and unpackaged MMICs is described. In order to determine the electrical behavior, a model of a single interconnection is developed using a full wave field simulation and compared to a model of a wire bond. Finally, the insertion losses are determined by measuring the output power of an active frequency doubler, which is assembled using both technologies. Because of the availability of commercial MMICs an operating frequency of 77 GHz is considered.
Keywords :
MMIC; integrated circuit interconnections; millimetre wave devices; surface mount technology; active frequency doubler; electrical behavior; electrical characteristics; frequency 77 GHz; full wave field simulation; insertion losses; manufacturing processes; millimeter wave frequency range; output power measurement; planar level chip interconnection; surface mounted device; unpackaged MMIC; unpackaged monolithic microwave integrated circuit; wire bond; Assembly; Inductance; Integrated circuit interconnections; Laminates; MMICs; Substrates; Wires;
Conference_Titel :
Semiconductor Conference Dresden (SCD), 2011
Conference_Location :
Dresden
Print_ISBN :
978-1-4577-0431-4
DOI :
10.1109/SCD.2011.6068689
