DocumentCode :
2217566
Title :
Current induced subthreshold trap generation, degradation, and breakdown in the thin oxide
Author :
Xu, Mingzhen ; Tan, Changhua ; Chen, Huan ; Duan, Xiaorong
Volume :
2
fYear :
2001
fDate :
22-25 Oct. 2001
Firstpage :
932
Abstract :
In this paper, the complete time dependent dielectric breakdown characteristics, the relaxation behavior, generation probabilities and/or rates of two traps, and establish the relationship between the trap generation time constants and the time-to-breakdown have been investigated. The analytical results show that the generation time constant for the induced subthreshold and intrinsic traps are all proportional to the time to breakdown, therefore the time to breakdown under low electric field can be estimated through the time constant, of induced subthreshold trap, and the measuring time can be significantly reduced.
Keywords :
MOSFET; dielectric materials; dielectric relaxation; semiconductor device breakdown; semiconductor device measurement; semiconductor device models; silicon compounds; SiO2; current induced subthreshold trap generation; dielectric relaxation behavior; low electric field; poly-Si-gate n-MOSFET; time dependent dielectric breakdown; time-to-breakdown; trap generation probability; trap generation time constants; Bonding; Character generation; Degradation; Dielectric breakdown; Electric breakdown; Electric variables measurement; Electron traps; Equations; Integrated circuit reliability; Time measurement;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Solid-State and Integrated-Circuit Technology, 2001. Proceedings. 6th International Conference on
Print_ISBN :
0-7803-6520-8
Type :
conf
DOI :
10.1109/ICSICT.2001.982048
Filename :
982048
Link To Document :
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