Title :
CAD tools for multi-radio high-frequency design
Author :
Hussein, Yasser A.
Author_Institution :
PedaSoft LLC, Chandler, AZ, USA
Abstract :
Advances in technology have enabled the possibilities to integrate multi-band and multi-mode radios into single packaged chips covering the diversity of communication standards from 2G GSM, 3G UMTS, to 4G LTE and LTE-advanced as well as WLAN, BT, and GPS impart unique challenges on the RF CAD due to the high complexity and integration of such chips. This requires simulation of the package as a whole to include electromagnetic coupling, interference, and radiation. The focus in this paper will be on the challenges and requirements as well as the latest trends on multi-radio CAD. A thorough discussion of advanced techniques for receivers and transmitters modeling of multi-radio SoC or SiP will be presented.
Keywords :
electromagnetic coupling; radio receivers; radio transmitters; radiofrequency integrated circuits; radiofrequency interference; system-in-package; system-on-chip; technology CAD (electronics); 2G GSM; 3G UMTS; 4G LTE; CAD tools; GPS; LTE-advanced; RF CAD; SiP; WLAN; communication standards; electromagnetic coupling; electromagnetic interference; electromagnetic radiation; multiband radios; multimode radios; multiradio SoC; multiradio high-frequency design; receiver modeling; single packaged chips; transmitter modeling; Couplings; Design automation; Integrated circuit modeling; Layout; Radio frequency; Solid modeling; Transistors; CAD tools; RF design; modling; multi-radio; simulation;
Conference_Titel :
Wireless and Microwave Technology Conference (WAMICON), 2012 IEEE 13th Annual
Conference_Location :
Cocoa Beach, FL
Print_ISBN :
978-1-4673-0129-9
Electronic_ISBN :
978-1-4673-0128-2
DOI :
10.1109/WAMICON.2012.6208481
