• DocumentCode
    2218211
  • Title

    A high frequency, high power miniature DC to DC power supply utilizing MCM-L technology

  • Author

    Miller, Greg ; Salatino, Matt

  • Author_Institution
    Harris Semicond., NC, USA
  • fYear
    1996
  • fDate
    6-7 Feb 1996
  • Firstpage
    67
  • Lastpage
    72
  • Abstract
    Harris Semiconductor participates in the Intelligent Power (IP) market, delivering various products used in industrial and commercial power supplies and power control systems. Intelligent Power refers to the integration of analog, logic, and high power handling circuits into a single chip. Harris Semiconductor´s expertise in this arena has produced products which can deliver voltages up to 100 VDC and currents in excess of 10 amperes with switching speeds under 3 nanoseconds. Switching high currents this quickly can cause damaging voltage spikes when encapsulated in plastic packages. Much of our IP customer base is concerned with power supply size and efficiency. The subtleties of developing a power supply that transcends these issues can derail even the best die and package design efforts. To assist in our customers´ system-level solutions, Harris is combining our Intelligent Power devices with other normally discrete components into a low cost, high performance laminate Multi-Chip Module (MCM-L) embodiment of a major power supply building block. This paper describes Harris´ effort from the problem statement to the comparative physical and performance results of the solution
  • Keywords
    DC-DC power convertors; multichip modules; switched mode power supplies; 1 MHz; 11.2 A; 3.1 V; 5 V; DC-DC power supply; Harris Semiconductor; MCM-L technology; high frequency operation; high power miniature power supply; intelligent power; laminate multichip module; Electrical equipment industry; Electricity supply industry; Frequency; Industrial control; Intelligent systems; Packaging; Power control; Power semiconductor switches; Power supplies; Voltage;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Multi-Chip Module Conference, 1996. MCMC-96, Proceedings., 1996 IEEE
  • Conference_Location
    Santa Cruz, CA
  • Print_ISBN
    0-8186-7286-2
  • Type

    conf

  • DOI
    10.1109/MCMC.1996.510771
  • Filename
    510771