Title :
A new multichip-on-silicon packaging scheme with integrated passive components
Author :
Guérin, L. ; Sachot, R. ; Dutoit, M.
Author_Institution :
Inst. for Micro- and Optoelectron., Swiss Federal Inst. of Technol., Lausanne, Switzerland
Abstract :
A new multichip-on-silicon packaging scheme for microelectronic circuits, sensors and actuators is presented. Its main characteristics and advantages over other schemes are discussed. A description of some key fabrication steps is given. Finally, the realization and the characterization of passive integrated components such as inductors and capacitors are discussed
Keywords :
microactuators; microassembling; microsensors; multichip modules; silicon; surface topography; MCM; MIM capacitors; Si surfaces; actuators; fabrication; inductors; integrated passive components; microelectronic circuits; multichip-on-silicon packaging; rough surface bonding; sensors; Actuators; Circuits; Etching; MIM capacitors; Metal-insulator structures; Microelectronics; Packaging; Sensor phenomena and characterization; Silicon; Wafer bonding;
Conference_Titel :
Multi-Chip Module Conference, 1996. MCMC-96, Proceedings., 1996 IEEE
Conference_Location :
Santa Cruz, CA
Print_ISBN :
0-8186-7286-2
DOI :
10.1109/MCMC.1996.510772
