Title :
A cost analysis study of deposited-MCM active substrates for testability purposes
Author :
Oliver, J. ; Kerkhoff, H.
Author_Institution :
CNM Inst., Univ. Autonoma de Barcelona, Spain
Abstract :
MultiChip Modules (MCMs) are seen as a future powerful integration methodology for systems manufacturing. However, MCM testing has become one of the most challenging problem we will have to face in the next few years. In order to find cost effective solutions to the test of MCMs, test structures on active substrate must be considered. In this way, this paper presents cost analysis results based on yield calculations of test structures placed on active substrates
Keywords :
boundary scan testing; flip-chip devices; integrated circuit testing; multichip modules; substrates; MCM testing; cost analysis; deposited-MCM active substrates; flip-chip connected circuits; multichip modules; test structures; testability purposes; yield calculations; Automatic testing; Capacitance; Circuit testing; Costs; Integrated circuit interconnections; Integrated circuit packaging; Integrated circuit technology; Integrated circuit testing; Manufacturing; Multichip modules;
Conference_Titel :
Multi-Chip Module Conference, 1996. MCMC-96, Proceedings., 1996 IEEE
Conference_Location :
Santa Cruz, CA
Print_ISBN :
0-8186-7286-2
DOI :
10.1109/MCMC.1996.510773
