DocumentCode
2218278
Title
Flexible access to MCM technology via the multichip module designers´ access service (MIDAS)
Author
Peltier, Jennifer ; Hansford, Wes
Author_Institution
MIDAS Service, Information Sci. Inst., Marina del Rey, CA, USA
fYear
1996
fDate
6-7 Feb 1996
Firstpage
86
Lastpage
88
Abstract
The MCM Designers´ Access Service (MIDAS) allows designers to obtain prototype and small quantities of MCMs. The service currently maintains relationships with several MCM-D foundries, including: nChip in San Jose, CA; Micromodule Systems (MMS) in Cupertino, CA; and IBM Microelectrons in Hopewell Junction, NY. MIDAS provides a low-cost service achieved through a multi-project environment where the customers share tooling and substrate manufacturing costs. The service offers design support, distributes foundry design kits, groups the projects onto regularly scheduled runs, places orders, and supplies fully assembled modules. As well, MIDAS offers a limited selection of open-tooled, second-level packages, bare tested die (KGD), and test sockets. MIDAS functions as a technology enabler by supplying the designer with an interface “transparent” to the fabricator and common to multiple vendors. Foundries prefer to work with a single source who coordinates the details of user interactions. Thus, they avoid dealing with multiple customers and spare valuable overhead. The service operates on an on-going basis and has delivered modules to customers from each foundry. Commercial, military and educational/research institutions utilize the service. This paper discusses the background and current status of MIDAS. Additionally, plans for accessing mixed signal MCM technologies and flip chip bumping and assembly are reviewed
Keywords
flip-chip devices; integrated circuit design; integrated circuit manufacture; microassembling; multichip modules; MCM Designer Access Service; MCM technology; MIDAS; bare tested die; flip chip assembly; flip chip bumping; mixed signal MCM technologies; multichip module design; open-tooled second-level packages; test sockets; Assembly; Costs; Foundries; Job shop scheduling; Manufacturing; Multichip modules; Packaging; Prototypes; Sockets; Testing;
fLanguage
English
Publisher
ieee
Conference_Titel
Multi-Chip Module Conference, 1996. MCMC-96, Proceedings., 1996 IEEE
Conference_Location
Santa Cruz, CA
Print_ISBN
0-8186-7286-2
Type
conf
DOI
10.1109/MCMC.1996.510774
Filename
510774
Link To Document