DocumentCode :
2218411
Title :
A sensitivity-based wiresizing approach to interconnect optimization of lossy transmission line topologies
Author :
Xue, Tianxiong ; Kuh, Ernest S. ; Yu, Qingjian
Author_Institution :
Dept. of Electr. Eng., California Univ., Berkeley, CA, USA
fYear :
1996
fDate :
6-7 Feb 1996
Firstpage :
117
Lastpage :
122
Abstract :
This paper presents a sensitivity-based wiresizing algorithm for interconnect delay optimization of lossy transmission line topology under MCM technologies. Our approach computes the maximum delay and its sensitivities with respect to the widths of wires in the topology via high order moments based on an exact moment matching model. Compared with other approaches, it achieves analytical sensitivity computation and calculates higher order moments (sensitivities) recursively from lower order moments for tree network. It can yield optimal wiresizing solution for interconnect delay minimization. Experiments show that the delay estimation using high order moments is very accurate compared with SPICE simulation and our approach can reduce the maximum rising delay by over 60% with small penalty in routing area. Besides delay optimization, the final solution eliminates the over-shoot of response waveform and is robust under parameter variations
Keywords :
delays; integrated circuit interconnections; method of moments; multichip modules; network routing; sensitivity analysis; trees (mathematics); wiring; MCM technologies; delay optimization; high order moments; interconnect optimization; lossy transmission line topologies; maximum rising delay; moment matching model; parameter variations; routing area; sensitivity-based wiresizing approach; tree network; Computational modeling; Computer networks; Delay estimation; Network topology; Propagation delay; Propagation losses; Routing; SPICE; Transmission lines; Wires;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Multi-Chip Module Conference, 1996. MCMC-96, Proceedings., 1996 IEEE
Conference_Location :
Santa Cruz, CA
Print_ISBN :
0-8186-7286-2
Type :
conf
DOI :
10.1109/MCMC.1996.510780
Filename :
510780
Link To Document :
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