Modeling for wireless PA development

In the design of wireless and handset power amplifiers, modeling of both RF and thermal effects is extremely important. Furthermore, because of the high sensitivity to parasitics, even the modeling of chip devices in the output matching circuit is critical. This paper addresses approaches to such modeling. Finally, because of the limitations of device models and analytical techniques, we show that cosimulation with behavioral models is a practical and efficient way to evaluate power amplifier designs.