• DocumentCode
    2218552
  • Title

    Off-chip 400 Mbps signal transmission: noise reduction using non-resonant lengths and other techniques

  • Author

    Blennemann, Heinz ; Yang, Yao-Chao ; Nikel, Ron

  • Author_Institution
    Silicon Graphics Comput. Syst., Mountain View, CA, USA
  • fYear
    1996
  • fDate
    6-7 Feb 1996
  • Firstpage
    138
  • Lastpage
    142
  • Abstract
    A 400 Mbps single-ended off-chip link including an open-drain driver and quasi-differential receiver has been designed, simulated, and measured. In this work, the design choices, in particular as related to noise tolerance, are discussed. To reduce the reflections inherent in signal propagation at a 400 Mbps rate, both the data and clock interconnects are restricted to non-resonant lengths. To further improve impedance matching, a daisy-chain termination is evaluated in which the net termination occurs after rather than before, the package pin. Other methods of reducing reflection noise are discussed, such as providing resistor terminations on an SCM or MCM package in order to reduce stub lengths. Measurements indicate good agreement with simulation; when the link is implemented with the noise-reducing features described the measured noise and jitter is sufficiently low for reliable operation at 400 Mbps
  • Keywords
    circuit noise; clocks; driver circuits; impedance matching; integrated circuit interconnections; integrated circuit packaging; receivers; 400 Mbit/s; IC interconnections; IC packaging; daisy-chain termination; impedance matching; noise reduction; noise tolerance; noise-reducing features; nonresonant lengths; open-drain driver; quasi-differential receiver; reflection noise; resistor terminations; signal propagation; single-ended off-chip link; stub lengths; Acoustic reflection; Clocks; Delay; Driver circuits; Frequency; Graphics; Noise measurement; Noise reduction; Packaging; Silicon;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Multi-Chip Module Conference, 1996. MCMC-96, Proceedings., 1996 IEEE
  • Conference_Location
    Santa Cruz, CA
  • Print_ISBN
    0-8186-7286-2
  • Type

    conf

  • DOI
    10.1109/MCMC.1996.510784
  • Filename
    510784