DocumentCode
2218682
Title
Early system noise analysis in mixed-signal silicon-on-silicon MCM systems
Author
Xi, Joe C. ; Dai, Wayne W M
Author_Institution
Dept. of Comput. Eng., California Univ., Santa Cruz, CA, USA
fYear
1996
fDate
6-7 Feb 1996
Firstpage
166
Lastpage
169
Abstract
Noise generated by digital circuit switching is a major challenge in designing mixing-signal systems. It is important to analyze the amount of noise prior to implementation so that appropriate design decisions can be made early to avoid performance and cost pitfalls. We project the power/ground noise and substrate coupling noise as functions of digital subsystems and technology parameters. The amount of switching digital circuits and their activities are accurately modeled. This can be used as an analysis tool to evaluate tradeoffs of different system implementation approaches and technology choices in the early design stage. This analysis is based on both single chip and silicon-on-silicon MCM mixed-signal systems such that the tradeoffs between a single-chip and an MCM implementation can be evaluated. Case studies have shown our analysis are in reasonable agreement with measured and detailed circuit simulation results
Keywords
circuit analysis computing; elemental semiconductors; integrated circuit measurement; integrated circuit noise; integrated circuit packaging; mixed analogue-digital integrated circuits; multichip modules; silicon; circuit simulation results; digital circuit switching; early design stage; mixed-signal Si-on-Si MCM; power/ground noise; substrate coupling noise; system noise analysis; Circuit noise; Circuit simulation; Costs; Coupling circuits; Digital circuits; Noise generators; Performance analysis; Power system modeling; Semiconductor device measurement; Switching circuits;
fLanguage
English
Publisher
ieee
Conference_Titel
Multi-Chip Module Conference, 1996. MCMC-96, Proceedings., 1996 IEEE
Conference_Location
Santa Cruz, CA
Print_ISBN
0-8186-7286-2
Type
conf
DOI
10.1109/MCMC.1996.510789
Filename
510789
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