Title :
Correlation based local measurement of small CTE for high temperature power electronics packaging
Author :
Hammacher, J. ; Dost, M. ; Seiler, B. ; Scheiter, L. ; Noack, E. ; Rzepka, S. ; Michel, B.
Author_Institution :
Chemnitzer Werkstoffmechanik GmbH, Chemnitz, Germany
Abstract :
The image based displacement analysis called Digital Image Correlation (DIC) can be used as an alternative to classical TMA and other bulk methods to measure CTE-values of electronic packaging materials. By combining the operation of the thermally optimized commercial equipment EQUINOX from the company OMI and the correlation software VEDDAC of CWM GmbH Chemnitz, it was possible to develop a method to acquire anisotropic CTE values of specimens locally and with an accuracy of +/- 0.5*10-6 /K over the entire value scale.
Keywords :
correlation methods; electronic engineering computing; electronics packaging; image processing; power electronics; CWM GmbH Chemnitz; DIC; EQUINOX; VEDDAC; correlation based local measurement; correlation software; digital image correlation; high temperature power electronics packaging; image based displacement analysis; small CTE; thermally optimized commercial equipment; Correlation; Displacement measurement; Materials; Measurement uncertainty; Optical variables measurement; Reliability; Temperature measurement; CTE; digital image correlation; non-destructive testing; reliability;
Conference_Titel :
Semiconductor Conference Dresden (SCD), 2011
Conference_Location :
Dresden
Print_ISBN :
978-1-4577-0431-4
DOI :
10.1109/SCD.2011.6068734
