Title :
A new moment generation technique for interconnects characterized by measured or calculated S-parameters
Author :
Celik, M. ; Cangellaris, A.C. ; Deutsch, A.
Author_Institution :
Dept. of Electr. & Comput. Eng., Arizona Univ., Tucson, AZ, USA
Abstract :
In this paper we propose a new method for moment calculation appropriate for dispersive, lossy interconnects and related package discontinuities, transitions and junctions that are modeled in terms of either numerically extracted or measured frequency-dependent scattering parameters. The method first constructs a local regional function approximation to the frequency domain measured data around an expansion point, and then finds the moments easily from the rational function. Comparisons with real measurements are presented which demonstrate the validity and accuracy of the proposed method
Keywords :
S-parameters; integrated circuit interconnections; integrated circuit packaging; method of moments; IC interconnects; S-parameters; frequency-dependent scattering parameters; local regional function approximation; lossy interconnects; moment generation technique; package discontinuities; package junctions; package transitions; rational function; Character generation; Electromagnetic measurements; Frequency domain analysis; Frequency measurement; Function approximation; Integrated circuit interconnections; Integrated circuit measurements; Radio frequency; Scattering parameters; Transmission line measurements;
Conference_Titel :
Multi-Chip Module Conference, 1996. MCMC-96, Proceedings., 1996 IEEE
Conference_Location :
Santa Cruz, CA
Print_ISBN :
0-8186-7286-2
DOI :
10.1109/MCMC.1996.510794