• DocumentCode
    2218807
  • Title

    A new moment generation technique for interconnects characterized by measured or calculated S-parameters

  • Author

    Celik, M. ; Cangellaris, A.C. ; Deutsch, A.

  • Author_Institution
    Dept. of Electr. & Comput. Eng., Arizona Univ., Tucson, AZ, USA
  • fYear
    1996
  • fDate
    6-7 Feb 1996
  • Firstpage
    196
  • Lastpage
    201
  • Abstract
    In this paper we propose a new method for moment calculation appropriate for dispersive, lossy interconnects and related package discontinuities, transitions and junctions that are modeled in terms of either numerically extracted or measured frequency-dependent scattering parameters. The method first constructs a local regional function approximation to the frequency domain measured data around an expansion point, and then finds the moments easily from the rational function. Comparisons with real measurements are presented which demonstrate the validity and accuracy of the proposed method
  • Keywords
    S-parameters; integrated circuit interconnections; integrated circuit packaging; method of moments; IC interconnects; S-parameters; frequency-dependent scattering parameters; local regional function approximation; lossy interconnects; moment generation technique; package discontinuities; package junctions; package transitions; rational function; Character generation; Electromagnetic measurements; Frequency domain analysis; Frequency measurement; Function approximation; Integrated circuit interconnections; Integrated circuit measurements; Radio frequency; Scattering parameters; Transmission line measurements;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Multi-Chip Module Conference, 1996. MCMC-96, Proceedings., 1996 IEEE
  • Conference_Location
    Santa Cruz, CA
  • Print_ISBN
    0-8186-7286-2
  • Type

    conf

  • DOI
    10.1109/MCMC.1996.510794
  • Filename
    510794