Title :
MEMS module integration into SiGe BiCMOS technology for embedded system applications
Author :
Kaynak, M. ; Wietstruck, M. ; Zhang, W. ; Drews, J. ; Knoll, D. ; Korndörfer, F. ; Wipf, C. ; Schulz, K. ; Suchodoletz, M.V. ; Zoschke, K. ; Kaletta, K. ; Ehrmann, O. ; Leidich, S. ; Kurth, S. ; Tillack, B.
Author_Institution :
IHP, Frankfurt (Oder), Germany
Abstract :
The latest developments in RF-MEMS technology have paved the way for achieving high performance systems. Integration of MEMS modules into a BiCMOS process using an embedded solution is appearing to be the most promising one to enable the realization of fully integrated smart systems. This work gives an overview on different RF-MEMS modules integrated to a 0.25μm SiGe BiCMOS process. Back-end-of-line (BEOL) Integration, Substrate-Etch and Above-IC modules for mm-wave applications are detailed by different MEMS device examples.
Keywords :
BiCMOS integrated circuits; micromechanical devices; silicon compounds; MEMS module integration; RF-MEMS technology; SiGe; SiGe BiCMOS technology; above-IC modules; back-end-of-line integration; embedded system application; fully integrated smart systems; mm-wave applications; substrate-etch; BiCMOS integrated circuits; Copper; Inductors; Micromechanical devices; Silicon; Substrates; Switches; Embedded MEMS; MEMS-IC integration; RF-MEMS switch; deep-silicon etch; monolithic integration;
Conference_Titel :
Semiconductor Conference Dresden (SCD), 2011
Conference_Location :
Dresden
Print_ISBN :
978-1-4577-0431-4
DOI :
10.1109/SCD.2011.6068738
