DocumentCode :
2219097
Title :
Recent advances and issues in SiC process and device technologies
Author :
Ostling, Mikael ; Koo, S.M. ; Lee, S.-K. ; Danielsson, E. ; Zetterling, C.-M.
Author_Institution :
Dept. of Microelectron. & Inf. Technol., R. Inst. of Technol., Kista, Sweden
Volume :
2
fYear :
2001
fDate :
22-25 Oct. 2001
Firstpage :
1173
Abstract :
Silicon carbide (SiC) is a wide band-gap semiconductor material with potential applications for high power, high frequency, and high temperature devices. Commercially available substrates and devices together with the shown experimental prototypes show very good promises for the future while still a continued improvement in fabrication techniques and wafer substrates are required for economically viable production. The recent advances and critical issues in SiC device process technology and the current state-of-the art devices in SiC are reviewed.
Keywords :
semiconductor technology; silicon compounds; substrates; wide band gap semiconductors; SiC; SiC device process technology; fabrication technique; high frequency device; high power device; high temperature device; silicon carbide; wafer substrate; wide band gap semiconductor; Fabrication; Frequency; Power generation economics; Production; Prototypes; Semiconductor materials; Silicon carbide; Substrates; Temperature; Wide band gap semiconductors;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Solid-State and Integrated-Circuit Technology, 2001. Proceedings. 6th International Conference on
Print_ISBN :
0-7803-6520-8
Type :
conf
DOI :
10.1109/ICSICT.2001.982108
Filename :
982108
Link To Document :
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