DocumentCode
2219319
Title
In situ XPS investigation of the chemical surface composition during the ALD of ultra-thin aluminum oxide films
Author
Geidel, Marion ; Knaut, Martin ; Albert, Matthias ; Bartha, Johann W.
Author_Institution
Inst. of Semicond. & Microsyst. (IHM), Tech. Univ. Dresden, Dresden, Germany
fYear
2011
fDate
27-28 Sept. 2011
Firstpage
1
Lastpage
4
Abstract
Atomic layer deposition (ALD) is the most advanced technique for the fabrication of ultra-thin conformal films. To yield high quality films, the knowledge of chemical reactions and interactions between the substrate surface and the precursors is becoming increasingly important, especially within the very first ALD cycles. In this work, the ALD process of aluminum oxide with trimethylaluminum (TMA) and water is studied by using X-ray photoelectron spectroscopy (XPS) without vacuum break. This allows the investigation of the initial gaseous-solid-reactions, i. e. the chemisorption mechanism of the precursor molecules, with sub-monolayer resolution. The results show the ligand exchange during the ALD reactions and the dependence of the growth mode on the presence of hydroxyl groups and oxygen as adsorption sites on the substrate surface.
Keywords
X-ray photoelectron spectra; adsorption; aluminium compounds; atomic layer deposition; chemisorption; exchange interactions (electron); monolayers; organic compounds; surface composition; thin films; Al2O3; X-ray photoelectron spectroscopy; XPS; adsorption sites; atomic layer deposition; chemical interactions; chemical reactions; chemical surface composition; chemisorption; growth mode; hydroxyl groups; initial gaseous-solid-reactions; ligand exchange; submonolayer resolution; substrate surface; trimethylaluminum; ultrathin aluminum oxide films; vacuum breakage; water; Aluminum oxide; Atomic layer deposition; Chemicals; Films; Silicon; Substrates; Surface treatment; ALD; TMA; aluminum oxide; atomic layer deposition; in situ XPS; reaction mechanism; ultra-thin films;
fLanguage
English
Publisher
ieee
Conference_Titel
Semiconductor Conference Dresden (SCD), 2011
Conference_Location
Dresden
Print_ISBN
978-1-4577-0431-4
Type
conf
DOI
10.1109/SCD.2011.6068753
Filename
6068753
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