In-pixel implementation of an area-efficient analog-signal-processing for CMOS-3D image sensor

Author

Hafiane, Mohamed Lamine ; Blachnitz, Robert ; Manck, Otto ; Dibi, Zohir ; Wagner, Wilfried

Author_Institution

Inst. fur Tech. Inf. und Mikroelektron., Tech. Univ., Berlin, Germany

fYear

2011

fDate

27-28 Sept. 2011

Firstpage

1

Lastpage

4

Abstract

The paper presents the design and test of a 32×32 CMOS 3D-image sensor, based-on indirect time-of-flight (ToF) technique with its derived algorithm: MDSI (multiple double short time integration). The design key feature is the implementation, in pixel-level, of analog signal processing; namely: correlated double sampling (CDS) and analog averaging. Which leads to a significant enhancement in term of signal-to-noise ratio (SNR), while keeping reasonable fill-factor and power consumption. The chip has been fabricated using 0.6um standard CMOS process. The overall achieved performances exhibit an interesting trade-off.

Keywords

CMOS analogue integrated circuits; CMOS image sensors; CMOS-3D image sensor; area-efficient analog-signal-processing; correlated double sampling; in-pixel implementation; indirect time-of-flight technique; multiple double short time integration; signal-noise ratio; size 0.6 mum; CMOS integrated circuits; Cameras; Image sensors; Measurement by laser beam; Noise; Power lasers; Surface emitting lasers; CDS; CMOS ToF range camera; MDSI; analog averaging;

fLanguage

English

Publisher

ieee

Conference_Titel

Semiconductor Conference Dresden (SCD), 2011

Conference_Location

Dresden

Print_ISBN

978-1-4577-0431-4

Type

conf

DOI

10.1109/SCD.2011.6068755

Filename

6068755