Title :
Development of a SiC JFET-Based Six-Pack Power Module for a Fully Integrated Inverter
Author :
Xu, Fan ; Han, Timothy J. ; Jiang, Dong ; Tolbert, Leon M. ; Wang, Fei ; Nagashima, Jim ; Kim, Sung Joon ; Kulkarni, Srikanth ; Barlow, Fred
Author_Institution :
Dept. of Electr. Eng. & Comput. Sci., Univ. of Tennessee at Knoxville, Knoxville, TN, USA
Abstract :
In this paper, a fully integrated silicon carbide (SiC)-based six-pack power module is designed and developed. With 1200-V, 100-A module rating, each switching element is composed of four paralleled SiC junction gate field-effect transistors (JFETs) with two antiparallel SiC Schottky barrier diodes. The stability of the module assembly processes is confirmed with 1000 cycles of -40°C to +200°C thermal shock tests with 1.3°C/s temperature change. The static characteristics of the module are evaluated and the results show 55 mΩ on-state resistance of the phase leg at 200°C junction temperature. For switching performances, the experiments demonstrate that while utilizing a 650-V voltage and 60-A current, the module switching loss decreases as the junction temperature increases up to 150°C. The test setup over a large temperature range is also described. Meanwhile, the shoot-through influenced by the SiC JFET internal capacitance as well as package parasitic inductances are discussed. Additionally, a liquid cooled three-phase inverter with 22.9 cm × 22.4 cm × 7.1 cm volume and 3.53-kg weight, based on this power module, is designed and developed for electric vehicle and hybrid electric vehicle applications. A conversion efficiency of 98.5% is achieved at 10 kHz switching frequency at 5 kW output power. The inverter is evaluated with coolant temperature up to 95°C successfully.
Keywords :
Schottky diodes; capacitance; hybrid electric vehicles; inductance; invertors; junction gate field effect transistors; modules; silicon compounds; switching convertors; thermal shock; wide band gap semiconductors; JFET-based six pack power module; SiC; antiparallel SiC Schottky barrier diodes; capacitance; current 100 A; current 60 A; frequency 10 kHz; hybrid electric vehicle; integrated inverter; junction gate field effect transistors; liquid cooled three phase inverter; module assembly process; module switching loss; on-state resistance; package parasitic inductance; power 5 kW; size 22.4 cm; size 22.9 cm; size 7.1 cm; stability; static characteristic; switching element; switching performance; temperature 200 degC; thermal shock tests; voltage 1200 V; voltage 650 V; Inductance; JFETs; Logic gates; Multichip modules; Silicon carbide; Switches; Temperature measurement; Electric vehicle and hybrid electric vehicle (EV/HEV); SiC junction gate field-effect transistor (JFET); silicon carbide (SiC) inverter; six-pack power module;
Journal_Title :
Power Electronics, IEEE Transactions on
DOI :
10.1109/TPEL.2012.2205946