Title :
The MCM´s thermal testing
Author :
Koval, Vladimir A. ; Fedasyuk, Dmytro V.
Author_Institution :
CAD Dept, Lviv State Univ., Ukraine
fDate :
28 Apr-1 May 1996
Abstract :
In this paper, a method of simulation and testing of MCM´s thermal fields has been presented. The method is based on the MCM´s structure decomposition and formalization of the problem of heat exchange simulation among the elements of a structure. The general thermal model of the structure is presented as multilevel rectangular parallelepiped with the flat and bulky heat sources with the assumption about heat exchange with the environment by the system of initial and boundary conditions. Steady-state solution of thermal simulation problem in analytical form has been obtained. The “MONSTR-M” system of MCM´s thermal design is realized. Comparisons of experimental and simulated results are presented
Keywords :
heat transfer; integrated circuit modelling; integrated circuit testing; multichip modules; MCM; MONSTR-M system; design; heat exchange; model; multilevel rectangular parallelepiped; simulation; structure decomposition; testing; thermal field; Analytical models; Heat sinks; Heat transfer; Packaging; Pins; Resistance heating; Seals; Testing; Thermal conductivity; Thermal resistance;
Conference_Titel :
VLSI Test Symposium, 1996., Proceedings of 14th
Conference_Location :
Princeton, NJ
Print_ISBN :
0-8186-7304-4
DOI :
10.1109/VTEST.1996.510867
