The MCM´s thermal testing

Author

Koval, Vladimir A. ; Fedasyuk, Dmytro V.

Author_Institution

CAD Dept, Lviv State Univ., Ukraine

fYear

1996

fDate

28 Apr-1 May 1996

Firstpage

266

Lastpage

271

Abstract

In this paper, a method of simulation and testing of MCM´s thermal fields has been presented. The method is based on the MCM´s structure decomposition and formalization of the problem of heat exchange simulation among the elements of a structure. The general thermal model of the structure is presented as multilevel rectangular parallelepiped with the flat and bulky heat sources with the assumption about heat exchange with the environment by the system of initial and boundary conditions. Steady-state solution of thermal simulation problem in analytical form has been obtained. The “MONSTR-M” system of MCM´s thermal design is realized. Comparisons of experimental and simulated results are presented

Keywords

heat transfer; integrated circuit modelling; integrated circuit testing; multichip modules; MCM; MONSTR-M system; design; heat exchange; model; multilevel rectangular parallelepiped; simulation; structure decomposition; testing; thermal field; Analytical models; Heat sinks; Heat transfer; Packaging; Pins; Resistance heating; Seals; Testing; Thermal conductivity; Thermal resistance;

fLanguage

English

Publisher

ieee

Conference_Titel

VLSI Test Symposium, 1996., Proceedings of 14th

Conference_Location

Princeton, NJ

ISSN

1093-0167

Print_ISBN

0-8186-7304-4

Type

conf

DOI

10.1109/VTEST.1996.510867

Filename

510867