• DocumentCode
    2220130
  • Title

    T-shape gate process & its application in HFET fabrication

  • Author

    Zheng, Yingkui ; He, Zhijing ; Wu, Dexin

  • Author_Institution
    Microelectron. R&D Center, Chinese Acad. of Sci., Beijing, China
  • Volume
    2
  • fYear
    2001
  • fDate
    22-25 Oct. 2001
  • Firstpage
    1334
  • Abstract
    This paper will discuss the process of T-shape gate that has been developed by direct-write electron beam lithography (EBL). The multilayer resist technique and different developing and lift-off are used to obtain a T-shape gate structure. The bottom of the "T" gate is about 100 nm. In order to realize the application of the T-shape gate in device, Heterojunction field effect transistors (HFET) have been fabricated using these T-gate structures. The extrapolated unity current gain frequency (ft) and transconductance (gm) of these transistors is 86.77 GHz and 450 ms/mm respectively.
  • Keywords
    electron beam lithography; junction gate field effect transistors; 100 nm; 86.77 GHz; HFET fabrication; T-shape gate; direct-write electron beam lithography; lift-off; multilayer resist; transconductance; unity current gain frequency; Electron beams; FETs; Fabrication; Frequency; HEMTs; Heterojunctions; Lithography; MODFETs; Nonhomogeneous media; Resists;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Solid-State and Integrated-Circuit Technology, 2001. Proceedings. 6th International Conference on
  • Print_ISBN
    0-7803-6520-8
  • Type

    conf

  • DOI
    10.1109/ICSICT.2001.982148
  • Filename
    982148