DocumentCode :
2220130
Title :
T-shape gate process & its application in HFET fabrication
Author :
Zheng, Yingkui ; He, Zhijing ; Wu, Dexin
Author_Institution :
Microelectron. R&D Center, Chinese Acad. of Sci., Beijing, China
Volume :
2
fYear :
2001
fDate :
22-25 Oct. 2001
Firstpage :
1334
Abstract :
This paper will discuss the process of T-shape gate that has been developed by direct-write electron beam lithography (EBL). The multilayer resist technique and different developing and lift-off are used to obtain a T-shape gate structure. The bottom of the "T" gate is about 100 nm. In order to realize the application of the T-shape gate in device, Heterojunction field effect transistors (HFET) have been fabricated using these T-gate structures. The extrapolated unity current gain frequency (ft) and transconductance (gm) of these transistors is 86.77 GHz and 450 ms/mm respectively.
Keywords :
electron beam lithography; junction gate field effect transistors; 100 nm; 86.77 GHz; HFET fabrication; T-shape gate; direct-write electron beam lithography; lift-off; multilayer resist; transconductance; unity current gain frequency; Electron beams; FETs; Fabrication; Frequency; HEMTs; Heterojunctions; Lithography; MODFETs; Nonhomogeneous media; Resists;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Solid-State and Integrated-Circuit Technology, 2001. Proceedings. 6th International Conference on
Print_ISBN :
0-7803-6520-8
Type :
conf
DOI :
10.1109/ICSICT.2001.982148
Filename :
982148
Link To Document :
بازگشت