DocumentCode
2220130
Title
T-shape gate process & its application in HFET fabrication
Author
Zheng, Yingkui ; He, Zhijing ; Wu, Dexin
Author_Institution
Microelectron. R&D Center, Chinese Acad. of Sci., Beijing, China
Volume
2
fYear
2001
fDate
22-25 Oct. 2001
Firstpage
1334
Abstract
This paper will discuss the process of T-shape gate that has been developed by direct-write electron beam lithography (EBL). The multilayer resist technique and different developing and lift-off are used to obtain a T-shape gate structure. The bottom of the "T" gate is about 100 nm. In order to realize the application of the T-shape gate in device, Heterojunction field effect transistors (HFET) have been fabricated using these T-gate structures. The extrapolated unity current gain frequency (ft) and transconductance (gm) of these transistors is 86.77 GHz and 450 ms/mm respectively.
Keywords
electron beam lithography; junction gate field effect transistors; 100 nm; 86.77 GHz; HFET fabrication; T-shape gate; direct-write electron beam lithography; lift-off; multilayer resist; transconductance; unity current gain frequency; Electron beams; FETs; Fabrication; Frequency; HEMTs; Heterojunctions; Lithography; MODFETs; Nonhomogeneous media; Resists;
fLanguage
English
Publisher
ieee
Conference_Titel
Solid-State and Integrated-Circuit Technology, 2001. Proceedings. 6th International Conference on
Print_ISBN
0-7803-6520-8
Type
conf
DOI
10.1109/ICSICT.2001.982148
Filename
982148
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