Title :
Growth of AlInAs/GaInAs MODFET structures on InP substrates by molecular beam epitaxy (MBE)
Author :
Wu, Yibin ; Chen, Ha ; Shang, Yaohui
Author_Institution :
Hebei Semicond. Res. Inst., Shijiazhuang, China
Abstract :
We have extensively studied the relationship between growth conditions and electron transfer properties during growth of AlInAs/GaInAs/InP MODFET structures by MBE. The structure quality can be successfully controlled by controlling growth surface reconstruction status via observation of RHEED patterns and the growth phase diagram of Ga0.47In0.93As layers. For lattice matched channel, the optimal spacer thickness was determined to be 40 Å after considering scattering and electron density loss in the channel as well as Si planar doped layer parallel conductance effect, and μ300k and 2DEG density are typically more than 10,000 cm2/v.s. and 2.5E12 cm-2, respectively. For pseudomorphic channel, we have compared results of two type distributions of In composition in the GaInAs pseudomorphic channel, i.e. rectangular ´Δ´ type and ´V´ type, and experiments demonstrated that ´V´ type has advantages. After optimization of growth conditions, our best MODFET structure result reaches nearly μ300k∼3000 cm2/v.s. 2DEG≥2.5E12 cm-2.
Keywords :
III-V semiconductors; aluminium compounds; electron density; gallium arsenide; high electron mobility transistors; indium compounds; molecular beam epitaxial growth; phase diagrams; reflection high energy electron diffraction; semiconductor device measurement; semiconductor growth; two-dimensional electron gas; 40 A; AlInAs-GaInAs; AlInAs/GaInAs MODFET structures; HEED patterns; InP; InP substrates; MBE; electron density; electron transfer properties; growth conditions; growth phase diagram; growth surface reconstruction; lattice matched channel; molecular beam epitaxy; optimal spacer thickness; parallel conductance; pseudomorphic channel; Density measurement; HEMTs; Indium phosphide; Lattices; MODFETs; Molecular beam epitaxial growth; Substrates; Surface reconstruction; Temperature; Thickness measurement;
Conference_Titel :
Solid-State and Integrated-Circuit Technology, 2001. Proceedings. 6th International Conference on
Print_ISBN :
0-7803-6520-8
DOI :
10.1109/ICSICT.2001.982152